Scientists Invented a Completely New Material for the Assembly of Smartphones

Professor Wayne Hayes presented a new substance that can bind materials by surface adhesion.

The scientist suggests using this material in the manufacture of smartphones. It is the glue that allows to easily disassemble the device, if necessary.

If to affect the glue by a magnetic field of a certain frequency, it will stop to be sticky. When exposed to such a magnetic field, the adhesive molecules will peel off in half a minute.

Wayne Hayes convinced smartphone manufacturers that magnetic fields of “peel-off” frequencies are not found in nature so that the reliability and integrity of products will not be at risk.

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